Reviewed Journal Publications

Telang, A. U.; Bieler, T. R.; Lucas, J. P.; Suburamanian, K. N.; Lehman, L. P.; Xing, Y.; Cotts, E. J. "Grain-boundary Character and Grain Growth in Bulk Tin and Bulk Lead-Free Solder Alloys," Journal of Electronic Materials 33 (12), 1412-1423, (2004).

Telang, A.U.; Bieler, T.R.; Lucas, J.P.; Subramanian, K.N.; Lehman, L.P.; Xing, Y.; Cotts, E.J. "Grain-Boundary Character and Grain Growth in Bulk Tin and Bulk Lead-Free Solder Alloys," J. Electronic Materials 33, 1412, (2004).

Telang, A.U.; Bieler, T.R.; Lucas, J.P.; Subramanian, K.N.; Lehman, L.P.; Xing, Y.; Cotts, E.J. "Grain Boundary Character and Grain Growth in Bulk Tin and Bulk Lead-free Solder Alloys," J Electronic Materials 33(12), 1412-1423, (2004).

Guo, F.; Choi, S.; Subramanian, K. N.; Bieler, T. R.; Lucas, J. P.; Achari, A.; Paruchuri, M. "Evaluation of Creep Behavior of Near Eutectic Sn-Ag Solders Containing Small Amount of Alloy Additions," Materials Science and Engineering A351/1-2, 190-199, (2003).

Lucas, J. P.; Rhee, H.; Guo, F.; Subramanian, K. N. "Nanoindentation Mechanical Properties of Intermetallic Compounds Formed Pb-Free Sn-Ag Solder Joints," Journal of Electronic Materials 32(12), 1375-1383, (2003)

Smith, L.M.; Averill, R.C.; Lucas, J.P; Stoughton, T.B.; Matin, P.H. "Influence of Transverse Normal Stress on Sheet Metal Formability," Int'l J. of Plasticity 19, 1567-1583, (2003).

Lucas, J.P.; Rhee, H.; Guo F.; Subramanian K.N. "Mechanical Properties of Intermetallic Compound Associated with Pb-Free Solder Joints Using Nanoindentation," J. Electronic Materials 32, 1375-1383 (2003).